Journal
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Volume 33, Issue 4, Pages 754-760Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCAPT.2010.2060198
Keywords
3-D embedding; chip package; flexible; thin chip
Categories
Funding
- IP-SHIFT [507745]
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Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin-on PI layers, the ultra-thin chip package (UTCP). This paper discusses the different process steps in the UTCP production and also presents the interconnection test results realized with this technology.
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