Journal
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
Volume 21, Issue 3, Pages 1592-1595Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TASC.2010.2093492
Keywords
HTS pancake coils; mechanical integrity; no-insulation winding; thermal stability; turn-to-turn-insulation
Funding
- National Center for Research Resources
- National Institute of Biomedical Imaging and Bioengineering
- National Institute of General Medical Sciences, NIH
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This paper reports a study of HTS pancake coils without turn-to-turn insulation. Three no-insulation (NI) pancake coils were wound: each single and double pancake coil of Bi2223 conductor and one single pancake of ReBCO conductor. An equivalent electrical circuit for modeling NI coils was verified by two sets of test: 1) charge-discharge; and 2) sudden discharge. Also, an overcurrent test in which a current exceeding a coil's critical current by 2.3 times was performed, and analysed, to demonstrate that in terms of stability NI HTS coils outperform their counterparts. The new NI winding offers HTS coils enhanced performance in three key parameters: overall current density; thermal stability; and mechanical integrity.
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