Journal
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION
Volume 62, Issue 3, Pages 1507-1512Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TAP.2013.2296318
Keywords
Data transmission; diffusion bonding; double-layer structure; full corporate feeding; high gain
Funding
- Strategic Information and Communications R&D Promotion Programme, the Ministry of Internal Affairs and Communications
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This communication proposes high gain antennas having broad bandwidth characteristic for the 120 GHz band. The proposed antennas are fabricated by diffusion bonding of laminated thin copper plates which have the advantages of high precision and low loss characteristic even in a high frequency region such as the 120 GHz band. For stable fabrication using diffusion bonding, we propose a feeding structure which has a double layer. A 32 x 32-element array antenna shows more than a 38 dBi antenna gain with over 60% antenna efficiency and 15 GHz bandwidth (119.0-134.0 GHz) and a 64 x 64-element array shows a higher than 43 dBi antenna gain with over 50% antenna efficiency and 14.5 GHz bandwidth (118.5-133.0 GHz), respectively.
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