Journal
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION
Volume 61, Issue 4, Pages 1623-1630Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TAP.2012.2232895
Keywords
Antenna-in-package; electronic packaging; printed antenna; 60 GHz antennas
Funding
- National Science Foundation [ECCS-1027703]
- Directorate For Engineering
- Div Of Electrical, Commun & Cyber Sys [1027703] Funding Source: National Science Foundation
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This paper presents the design of a 60 GHz antenna to be used in multi-core multi-chip (MCMC) computing systems. The antenna in package (AiP) solution has a ground-shielded metal and a periodically-patched artificial magnetic conductor (AMC) structure to widen the reflection coefficient bandwidth. The designed antenna with AMC layer broadcasts signals in the horizontal direction. Both simulated and measured results demonstrate that a -10 dB reflection coefficient is achieved for a 10 GHz bandwidth and that radiation in the horizontal (chip-to-chip) direction is maintained.
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