Journal
IEEE TRANSACTIONS ON ADVANCED PACKAGING
Volume 32, Issue 2, Pages 345-359Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TADVP.2009.2014877
Keywords
Complementary metal-oxide-semiconductor (CMOS) analog integrated circuits; integrated optoelectronics; optical planar waveguides; optical receivers; optical transmitters; optoelectronic packaging; parallel optical interconnections
Categories
Funding
- U.S. Defense Advanced Research Project Agency [MDA972-03-3-0004]
Ask authors/readers for more resources
We have developed parallel optical interconnect technologies designed to support terabit/s-class chip-to-chip data transfer through polymer waveguides integrated in printed circuit boards (PCBs). The board-level links represent a highly integrated packaging approach based on a novel parallel optical module, or Optomodule, with 16 transmitter and 16 receiver channels. Optomodules with 16 Tx + 16 Rx channels have been assembled and fully characterized, with transmitters operating at data rates up to 20 Gb/s for a 2(7) - 1 PRBS pattern. Receivers characterized as fiber-coupled 16-channel transmitter-to-receiver links operated error-free up to 15 Gb/s, providing a 240 Gb/s aggregate bidirectional data rate. The low-profile Optomodule is directly surface mounted to a circuit board using convention ball grid array (BGA) solder process. Optical coupling to a dense array of polymer waveguides fabricated on the PCB is facilitated by turning mirrors and lens arrays integrated into the optical PCB. A complete optical link between two Optomodules interconnected through 32 polymer waveguides has been demonstrated with each unidirectional link operating at 10 Gb/s achieving a 160 Gb/s bidirectional data rate. The full module-to-module link provides the fastest, widest, and most integrated multimode optical bus demonstrated to date.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available