Journal
IEEE PHOTONICS TECHNOLOGY LETTERS
Volume 23, Issue 15, Pages 1031-1033Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LPT.2011.2132124
Keywords
Heatsinks; metal cavities; semiconductor lasers; thermal impedance; thermal management; vertical-cavity surface-emitting lasers
Funding
- DARPA [W911NF-07-1-0314]
- A. von Humboldt Foundation
- Deutsche Forschungsgemeinschaft [SFB 787]
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The thermal impedance of a substrate-free metal cavity surface-emitting microlaser is measured. The lasing wavelength shifts with temperature at a ratio of 4.367 x 10(-2) nm/degrees C. An extremely low thermal impedance below 1.730 degrees C/mW is extracted for this microlaser with a 1.0-mu m radius and 3.5-mu m height in the temperature window of 20 degrees C-80 degrees C. The full metal coverage, substrate-free configuration, and metal bonding lead to efficient heat removal.
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