4.5 Article

InP-Based Membrane Couplers for Optical Interconnects on Si

Journal

IEEE PHOTONICS TECHNOLOGY LETTERS
Volume 21, Issue 5, Pages 337-339

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LPT.2008.2011649

Keywords

Bonding; flip-chip devices; optical interconnections

Funding

  1. EU
  2. IST-PICMOS project

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We present the design, fabrication, and characterization of a membrane coupler processed on an indium phosphide membrane layer on a silicon-on-insulator wafer, that is used for applications in optical interconnects on silicon. Measured coupler efficiency is 50%. The photonic device fabrication is compatible with wafer scale processing steps, guaranteeing compatibility towards future generation electronic integrated circuit processing.

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