Journal
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Volume 24, Issue 4, Pages 272-274Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LMWC.2013.2293668
Keywords
Built-in test; CMOS millimeter wave integrated circuits; design for testability; frequency response; temperature measurement
Categories
Funding
- Spanish Ministry of Science and Innovation
- EU-Feder [TEC2008-01856]
- AGAUR SGR [1497]
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This letter introduces a novel on-chip measurement technique for the determination of the central frequency and 3 dB bandwidth of a 60 GHz power amplifier (PA) by performing low frequency temperature measurements. The temperature sensor is embedded in the same silicon die as the PA, and placed in empty spaces next to it. Results confirm that temperature sensors can be used as functional built-in testers which serve to reduce testing costs and enhance yield as part of self-healing strategies.
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