Journal
IEEE JOURNAL OF SOLID-STATE CIRCUITS
Volume 47, Issue 1, Pages 194-205Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSSC.2011.2167814
Keywords
Clocking; Intel second-generation core; low Vccmin; modularity; power gates; thermal sensors
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This paper describes the second-generation Intel Core processor, a 32-nm monolithic die integrating four IA cores, a processor graphics, and a memory controller. Special attention is given to the circuit design challenges associated with this kind of integration. The paper describes the chip floor plan, the power delivery network, energy conservation techniques, the clock generation and distribution, the on-die thermal sensors, and a novel debug port.
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