4.6 Article

A Programmable Vision Chip Based on Multiple Levels of Parallel Processors

Journal

IEEE JOURNAL OF SOLID-STATE CIRCUITS
Volume 46, Issue 9, Pages 2132-2147

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSSC.2011.2158024

Keywords

CMOS sensor; image recognition; massive parallel; SIMD; vision chip

Funding

  1. National Natural Science Foundation of China [60976023]
  2. Chinese National High-Tech Researching and Development Projection [2008AA010703]
  3. special funds for Major State Basic Research Project of China [2011CB932902]

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This paper proposes a novel programmable vision chip based on multiple levels of parallel processors. The chip integrates CMOS image sensor, multiple-levels of SIMD parallel processors and an embedded microprocessor unit (MPU). The multiple-levels of SIMD parallel processors consist of an array processor of SIMD processing elements (PEs) and a column of SIMD row processors (RPs). The PE array and RPs have an O(N x N) parallelism and an O(N) parallelism, respectively. The PE array and RPs can be reconfigured to handle algorithms with different complexities and processing speeds. The PE array, RPs and MPU can execute low-, mid- and high-level image processing algorithms, respectively, which efficiently increases the performance of the vision chip. The vision chip can satisfy flexibly the needs of different vision applications such as image pre-processing, complicated feature extraction and over 1000 fps high-speed image capture. A prototype chip with 128 x 28 image sensor, 128 A/D converters, 32 8-bit RPs and 32 x 128 PEs is fabricated using the 0.18 mu m CMOS process. Applications including target tracking, pattern extraction and image recognition are demonstrated.

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