4.7 Article

Back-End Deposited Silicon Photonics for Monolithic Integration on CMOS

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSTQE.2012.2209865

Keywords

CMOS technology; excimer laser annealing (ELA); integrated optics; optical modulators; photodetectors; polycrystalline silicon; silicon nitride (SiN); silicon photonics (SiP)

Funding

  1. Defense Advanced Research Projects Agency [W911NF-11-1-0435]
  2. Intel Corporation

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We present the vision of back-end deposited silicon photonics (BDSP) and review works that have been done in this field. Individual aspects of BDSP platform including excimer-laser-annealed polycrystalline silicon, low-loss plasma-enhanced chemical vapor deposition silicon nitride waveguide, modulator, detector, electrical interface, back-end CMOS compatibility, and benefits of the platform are discussed in detail.

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