Journal
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
Volume 15, Issue 5, Pages 1500-1505Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSTQE.2009.2020812
Keywords
Integrated optics; low-temperature bonding; microsensors; optical device fabrication; plasma applications
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Funding
- New Energy and Industrial Technology Development Organization (NEDO) of Japan
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Hybrid integration of multiple optical chips in three dimensions is an important technology for realizing highly functional, compact optoelectronic microsystems. In this paper, we report successful 3-D integration of optical chips performed using Au-Au surface-activated bonding (SAB) at a relatively low bonding temperature of 150 degrees C. A glass substrate with the flip-chip-bonded photodiode chips was vertically stacked on a Si substrate with the bonded laser diode chip using Au-Au SAB. By applying this technique, compact and thin optical microsensors (2.8 mm x 2.8 mm x 1 mm thick) were fabricated. The feasibility of measuring velocity was demonstrated using prototype microsensors.
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