4.6 Article

Interface Charge Engineering for Enhancement-Mode GaN MISHEMTs

Journal

IEEE ELECTRON DEVICE LETTERS
Volume 35, Issue 3, Pages 312-314

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2013.2296659

Keywords

AlGaN/GaN HEMT; MISHEMT; ALD; normally-off; E-mode; interface fixed charges; electron mobility; remote impurity scattering; oxygen plasma; post-metallization anneal (PMA)

Funding

  1. Office of Naval Research DEFINE MURI program [ONR N00014-10-1-0937]

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We demonstrate an efficient approach to engineer the dielectric/AlGaN positive interface fixed charges by oxygen plasma and post-metallization anneal. Significant suppression of interface fixed charges from 2 x 10(13) to 8 x 10(12) cm(-2) was observed. Experimental and theoretical electron mobility characteristics and the impact of remote impurity scattering were investigated. The reduction in oxide/semiconductor interface charge density leads to an increase of electron mobility, and enables a positive threshold voltage.

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