Journal
IEEE ELECTRON DEVICE LETTERS
Volume 34, Issue 2, Pages 166-168Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2012.2230393
Keywords
Current saturation; graphene field-effect transistor (FET); scaling; self-heating; thermal transient
Categories
Funding
- Office of Naval Research
- Nanotechnology Research Initiative (NRI)
- National Science Foundation CAREER Award
- Div Of Electrical, Commun & Cyber Sys
- Directorate For Engineering [0954423] Funding Source: National Science Foundation
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We use simulations to examine current saturation in sub-micron graphene transistors on SiO2/Si. We find that self-heating is partly responsible for current saturation (lower output conductance) but degrades current densities above 1 mA/mu m by up to 15%. Heating effects are reduced if the supporting insulator is thinned or, in shorter channel devices, by partial heat sinking at the contacts. The transient behavior of such devices has thermal time constants of similar to 30-300 ns, which is dominated by the thickness of the supporting insulator and that of the device capping layers (a behavior also expected in ultrathin-body SOI transistors). The results shed important physical insight into the high-field and transient behavior of graphene transistors.
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