4.6 Article

Improved Switching Uniformity and Low-Voltage Operation in TaOx-Based RRAM Using Ge Reactive Layer

Journal

IEEE ELECTRON DEVICE LETTERS
Volume 34, Issue 9, Pages 1130-1132

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2013.2271545

Keywords

Resistive random access memory (RRAM); TaOx; uniformity

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Significant improvements in the spatial and temporal uniformities of device switching parameters are successfully demonstrated in Ge/TaOx bilayer-based resistive switching devices, as compared with non-Ge devices. In addition, the reported Ge/TaOx devices also show significant reductions in the operation voltages. Influence of the Ge layer on the resistive switching of TaOx-based resistive random access memory is investigated by X-ray spectroscopy and the theory of Gibbs free energy. Higher uniformity is attributed to the confinement of the filamentary switching process. The presence of a larger number of interface traps, which will create a beneficial electric field to facilitate the drift of oxygen vacancies, is believed to be responsible for the lower operation voltages in the Ge/TaOx devices.

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