Journal
IEEE ELECTRON DEVICE LETTERS
Volume 33, Issue 2, Pages 173-175Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2011.2176913
Keywords
High-K; metal gate; mobility; SiGe; strained-Ge (s-Ge)
Categories
Funding
- FCRP Center on Materials, Structures, and Devices
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Low-field effective hole mobility of highly strained (similar to 2.4%, biaxial) germanium-channel (7.8 nm-thick) p-MOSFETs with high-K/metal gate stack has been experimentally investigated. Devices with various ultrathin strained-Si cap layer thicknesses, as thin as similar to 8 angstrom, show excellent capacitance-voltage characteristics with no hysteresis or frequency dispersion and hole mobility enhancement of more than 6.5X over Si universal and 2.3X over similar devices with no strained-Si cap, at E-eff = 0.6 MV/cm. The influence of the strained-Si cap thickness on the hole mobility is also studied. The mobility increases with increasing Si cap thickness up to similar to 1.8 nm (with a peak mobility of 940 cm(2)/Vs at this cap thickness) consistent with a reduction in remote Coulombic scattering.
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