Journal
IEEE ELECTRON DEVICE LETTERS
Volume 33, Issue 1, Pages 41-43Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2011.2173456
Keywords
AlGaN/GaN; current-aperture vertical electron transistor (CAVET); Mg-implanted; plasma-MBE
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Funding
- Toyota Motor Corporation, Japan
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A current aperture vertical electron transistor (CAVET) with a Mg-ion-implanted current blocking layer (CBL) and a channel regrown by plasma assisted molecular beam epitaxy (MBE), is successfully demonstrated on bulk GaN to work as a high voltage device. The fabrication of the device combined a drift region grown by metalorganic chemical vapor deposition (MOCVD), to hold the blocking voltage, with AlGaN/GaN layers regrown by plasma-MBE to conduct current. The device registered a maximum current of 4 kA.cm(-2) under direct-current operation offering a specific ON-state resistance R-on - A of 2.2 m Omega . cm(2). With 80 mu s pulses applied to the gate, the devices showed no dispersion. The increased aperture length Lap resulted in the decrease in specific R-on, as expected. The impact of the gate overlap to aperture L-go on the leakage current was studied, where the leakage current was found to increase with a smaller overlap.
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