Journal
IEEE ELECTRON DEVICE LETTERS
Volume 33, Issue 11, Pages 1541-1543Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2012.2214758
Keywords
Contact resistance; Fermi-level pinning; germanium; titanium dioxide
Categories
Funding
- Intel Corporation
- MSD Focus Center
- Stanford INMP
- Stanford Graduate Fellowship
- Intel Ph.D. Fellowship
Ask authors/readers for more resources
We report a metal-insulator-semiconductor (MIS) contact using a TiO2 interfacial layer on highly doped n(+) Ge to overcome the problem of metal-Fermi-level pinning on Ge, which results in a large electron barrier height. A specific contact resistivity of 1.3 x 10(-6) Omega . cm(2) was achieved, which represents a 70x reduction from conventional contacts. For the first time, interfacial layer conductivity is experimentally identified as an important consideration for high-performance MIS contacts. New insights on the mechanism responsible for contact resistance reduction are presented.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available