Journal
IEEE ELECTRON DEVICE LETTERS
Volume 32, Issue 1, Pages 42-44Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2010.2089426
Keywords
Amorphous; HfO2; HfOxNy; high permittivity; indium gallium zinc oxide (IGZO); thin-film transistors (TFTs)
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Funding
- 973 Program of China [2011CB933300]
- National High Technology Research and Development Program of China [2009AA03Z219]
- China Postdoctoral Science Foundation [20090451064]
- National Science Fund for Talent Training in Basic Science [J0830310]
- National Natural Science Foundation of China [11074194]
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We have fabricated and investigated amorphous indium gallium zinc oxide (alpha-IGZO) thin-film transistors (TFTs) by using HfOxNy/HfO2/HfOxNy (NON) as the gate dielectric. The NON tristack dielectric structure can increase the gate capacitance density, effectively improve interface properties of both the gate/dielectric and dielectric/active channels, suppress the charge trap density, and reduce the gate leakage. The alpha-IGZO TFT (W/L = 200/10 mu m) with NON shows superior performance such as a saturation current of 0.33 mA, an ON/OFF-current ratio of 2.2 x 10(6), a saturation mobility of 10.2 cm(2)/V . s, a source/contact resistivity of 83 Omega . cm, a subthreshold swing of 0.13 V/dec, and enhanced stressing reliability.
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