4.6 Article

Thermal Properties of Ultrathin Hafnium Oxide Gate Dielectric Films

Journal

IEEE ELECTRON DEVICE LETTERS
Volume 30, Issue 12, Pages 1269-1271

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2009.2032937

Keywords

Hafnium oxide; thermal conductivity; thermal interface resistance; picosecond pump-probe thermometry

Funding

  1. Semiconductor Research Corporation
  2. MARCO Interconnect Focus Center
  3. Defense University
  4. Stanford Graduate Fellowship
  5. Stanford Initiative in Nanoscale Materials and Processes

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Thin-film HfO2 is a promising gate dielectric material that will influence thermal conduction in modern transistors. This letter reports the temperature dependence of the intrinsic thermal conductivity and interface resistances of 56-200-angstrom-thick HfO2 films. A picosecond pump-probe thermoreflectance technique yields room-temperature intrinsic thermal conductivity values between 0.49 and 0.95 W/( m . K). The intrinsic thermal conductivity and interface resistance depend strongly on the film-thickness-dependent microstructure.

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