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Development of Epoxy Resin Composites With High Thermal Conductivity

Journal

IEEE ELECTRICAL INSULATION MAGAZINE
Volume 26, Issue 1, Pages 48-49

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/MEI.2010.5383936

Keywords

Thermal conductivity; Conductivity; Epoxy resins; Insulation; Chemicals; Data mining

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