Journal
IEEE COMMUNICATIONS MAGAZINE
Volume 51, Issue 3, Pages 72-77Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/MCOM.2013.6476868
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Funding
- Cabinet Office through its Funding Program for World-Leading Innovative R&D on Science and Technology (FIRST) Program
- Ministry of Economy, Trade and Industry through its Future Pioneering Project
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New semiconductor technologies such as many-core processors and 3D memories are being researched in order to overcome the limitations of electronics in the near future. Here, we first discuss some drawbacks of current technologies, and then show that silicon photonics will solve those interconnection problems. Next, we describe our studies toward realizing a system integration platform based on photonics and electronics convergence, and show that an optical interposer is the most efficient way to cope with the various problems that a purely electronic system may encounter. Our recent advances in silicon photonic devices are also described, and their integration into the hybrid interposer is reported through an early prototyping result. Finally, a surface mounted components approach for silicon photonics technology is discussed, which may prove useful in the computer and communication markets.
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