Optimization of plasma effect in laser drilling of high aspect ratio microvias

The simple theoretical model of heating side walls by laser plasma in the laser drilling of high aspect ratio microvias in metals and semiconductors is proposed. According to this model the recommendations are given on how to avoid the undesirable effect of melting side walls by laser plasma, strongly deteriorating microdrilling quality. The obtained results constitute a physical basis for the development of clean laser microdrilling. Particular estimations are given for the laser drilling of silicon wafers.