A new organosilicon adhesive based on polysiloxane and polysilazane

A new organosilicon adhesive was prepared by combining a vinyl-containing polysilazane (PSN) and a multifunctional polysiloxane (PSO). The adhesive was characterized by Fourier transform infrared spectroscopy. The effect of the PSN content on thermal properties of the adhesive was investigated by differential scanning calorimetry and thermal gravimetric analysis. On the basis of lap shear strength (LSS) test, the effects of the PSN content and the curing conditions on adhesive properties were evaluated. The sample with 20% of PSN cured at 170 degrees C/4h and then 330 degrees C/4h showed an LSS as high as 15.32MPa at room temperature and 1.93MPa at 400 degrees C. The LSS decreased with the increase in testing temperature.