Journal
HIGH PERFORMANCE POLYMERS
Volume 24, Issue 2, Pages 85-96Publisher
SAGE PUBLICATIONS LTD
DOI: 10.1177/0954008311433606
Keywords
polyhedral oligomeric silsesquioxane; polyimide; glass transition temperature; thermal stability; flame-retardant; dielectric constant
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Funding
- DST (Nanomission), New Delhi, Government of India [SR/NM/NS-18/2010]
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Polyhedral oligomeric silsesquioxane (POSS) - polyimide (PI) hybrid nanocomposites were prepared by a two-step approach, bisphenol-A ether diamine (BAED) and pyromelletic dianhydride (PMDA) in 1-methyl-2-pyrrolidone (NMP) were used to prepare polyamic acid (PAA) to which varying weight percentages of OAPS in NMP were added. During the second step, the polycondensation was effected by thermal imidization. The formation of hybrid nanocomposites was confirmed by using FTIR spectra. The thermal properties of POSS-PI nanocomposites were studied using differential scanning calorimetry and thermogravimetric analysis. The lowest dielectric constant 2.68 was achieved for 15 wt.% POSS-PI material when compared with the value of 3.34 for the neat PI. Data from thermal studies indicate that the incorporation of POSS into polyimide significantly enhanced the glass transition temperature (T-g), thermal stability, char yield and flame-retardant properties of hybrid nanocomposites than that of neat PI. The excellent combination of both dielectric and thermal properties of the material developed in the present study will find application in microelectronics.
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