Thermal Characteristics of a Chip-Scale Two-Phase Microgap Cooler

Two-phase heat transfer and pressure drop results for a chip-scale, uniformly heated, microgap channel, with nominal gap heights of 100, 200, and 500 mu m and using HFE-7100 and FC-87 as the working fluids, are reported. Average heat transfer coefficients in the range of 5 to 30 kW/m(2)-K were observed, for exit qualities up to 60%. Local heat transfer coefficients, obtained through an inverse computational technique, are found to vary strongly with thermodynamic quality and to fall within +/- 30% of the predictions of the venerable Chen correlation.