MICROELECTRONICS RELIABILITY
Note: The following journal information is for reference only. Please check the journal website for updated information prior to submission.
Journal Title
MICROELECTRONICS RELIABILITY
MICROELECTRON RELIAB
ISSN / eISSN
0026-2714
Aims and Scope
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
Subject Area
ENGINEERING, ELECTRICAL & ELECTRONIC
NANOSCIENCE & NANOTECHNOLOGY
PHYSICS, APPLIED
CiteScore
3.30
View Trend
CiteScore Ranking
Category | Quartile | Rank |
---|---|---|
Engineering - Safety, Risk, Reliability and Quality | Q2 | #83/207 |
Engineering - Electrical and Electronic Engineering | Q2 | #395/797 |
Engineering - Atomic and Molecular Physics, and Optics | Q3 | #118/224 |
Engineering - Condensed Matter Physics | Q3 | #230/434 |
Engineering - Surfaces, Coatings and Films | Q3 | #74/132 |
Engineering - Electronic, Optical and Magnetic Materials | Q3 | #161/284 |
Web of Science Core Collection
Science Citation Index Expanded (SCIE) | Social Sciences Citation Index (SSCI) |
---|---|
Indexed | - |
Category (Journal Citation Reports 2024) | Quartile |
---|---|
ENGINEERING, ELECTRICAL & ELECTRONIC | Q3 |
NANOSCIENCE & NANOTECHNOLOGY | Q4 |
PHYSICS, APPLIED | Q3 |
H-index
80
Country/Area of Publication
ENGLAND
Publisher
Elsevier Ltd
Publication Frequency
Monthly
Year Publication Started
1964
Annual Article Volume
310
Open Access
NO
Contact
PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OX5 1GB
Verified Reviews
2021.08.01 with editor
2021.08.02 under review
2021.08.08 under review
2021.08.11 under review
2021.08.28 decision in process
2021.08.30 revise
2021.09.29 resubmitted
2021.09.29 with editor
2021.10.01 under review
2021.10.16 under review
2021.10.29 under review
2021.11.23 decision in process
2021.11.25 minor
2021.12.23 resubmitted
2021.12.24 with editor
2022.01.04 under review
2022.01.06 Required Reviews Completed
2022.01.08 Decision in Process
2022.01.11 Accept
Translation:
2021.07.27 submitted to journal
2021.08.01 with editor
2021.08.02 under review
2021.08.08 under review
2021.08.11 under review
2021.08.28 decision in process
2021.08.30 revise
2021.09.29 resubmitted
2021.09.29 with editor
2021.10.01 under review
2021.10.16 under review
2021.10.29 under review
2021.11.23 decision in process
2021.11.25 minor
2021.12.23 resubmitted
2021.12.24 with editor
2022.01.04 under review
2022.01.06 Required Reviews Completed
2022.01.08 Decision in Process
2022.01.11 Accept
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