Electronic components

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Proposal page limits and layout: described in Part B of the Application Form available in the Submission System

2. Eligible countries: described in section 6 of the call document

3. Other eligibility conditions: described in section 6 of the call document

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Submission and evaluation processes: described section 8 of the call document and the Online Manual

Indicative timeline for evaluation and grant agreement: described in section 4 of the call document

6. Legal and financial set-up of the grants: described in section 10 of the call document

Call documents:

Call document

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- List of infrastructure, facilities, assets and resources

- Actual indirect cost methodology declarations (if actual indirect costs used)

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EDF General MGA v1.0

Additional documents:

EDF Annual Work Programme

EDF Regulation 2021/697

EU Financial Regulation 2018/1046

Rules for Legal Entity Validation, LEAR Appointment and Financial Capacity Assessment

EU Grants AGA — Annotated Model Grant Agreement

Funding & Tenders Portal Online Manual

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European competitiveness is increasingly dependent on the development of electronics. In recent years, the opportunities offered by Systems-On-a-Chip have become very apparent in many different technology sectors such as telecommunications, military, automotive, financial, medical research, and others.

Fundamental to this development is the integration of processing hardware, embedded programming software and firmware and high-speed digital-to-analogue and analogue-to-digital technology with low power consumption technology into a single component.

There is a need to invest in a European RF-CMOS supply chain and measures to mitigate the risk of export limitations connected to military applications. Building on the learnings from the GaN-supply chain cooperation, and based on the growing demand for integrated circuits, a European supply chain initiative, catalysed by military needs, is likely to become a very important tool for future European prosperity and for ensuring a long-term strategy of non-dependence for critical defence technologies.

Specific objective

This topic aims to increase interoperability and resilience, including secured production and exchange of data, to master critical defence technologies, to strengthen the security of supply and to enable the effective exploitation of results for defence products and technologies. The action should define strategies for development and ownership of advanced RF-CMOS supply chain in Europe, possibly a European Silicon foundry base aiming for advanced technology nodes for analog (RF) and digital circuits, as well as technologies or methodologies that enable use of other foundries without compromising assurance, where assurance pertains to both availability of the supply chain and its security.

The scope consists of two interacting parts:

• The development of RF-CMOS components and modules connected to current and future military applications, including the requirements for a production supply chain.
• How a non-dependent RF-CMOS European supply chain could be gained, or at least how measures to mitigate the risk of export limitations, high cost for low volume production or other limiting factor for a European supply chain can be implemented. A European supply chain must, but is not limited to, include one or more RF-CMOS fabrication site(s), mask generation, supply of wafers and other important raw materials necessary for advanced RF-CMOS processing. It may also include packaging and testing facilities.

Proposals must include studies, such as feasibility studies to explore new or upgraded products, technologies, processes, services and solutions.

Proposals should identify which components and modules are relevant for future systems and which manufacturing facilities are needed for such components and modules.

The action should develop a strategy for a European RF-CMOS fine pitch supply chain for manufacturing of high-speed and high-performance functional building blocks (data converters and FPGA) in the next generations of digital AESA Radar, wideband multifunctional RF systems. The nodes for each circuit (analog and digital) could be different to optimise the performance and be assembled with a system in package technology.

Taking in account the existing European manufacturing facilities and the civil programs such as CHIP JU, proposals should propose a design with a view to ensure:

• The non-dependence for defence systems integrating this RF-CMOS solution.
• The cost efficiency of the solution for low volume quantities (including NRE).

The proposals must avoid unnecessary duplications with other EU, intergovernmental or NATO initiatives.

Types of activities

The following table lists the types of activities which are eligible for this topic, and whether they are mandatory or optional (see Article 10(3) EDF Regulation):

Accordingly, the proposals must cover at least the following tasks as part of mandatory activities:

• Generating knowledge:
  • Describe the current European RF-CMOS supply chain and identify shortfalls and possible risks for military needs.
• Integrating knowledge:
  • Define functions and architectures for RF CMOS components;
  • Define typical specifications for RF CMOS components for the next generations of digital AESA Radars and wideband multifunctional RF systems from S to Ka Band.
  • Suggest silicon foundries for specified RF-CMOS components taking into account the following:
    • European foundries for sensitive components (sensitive means subject to export control from countries or industry)
    • The constraint of low volume.
• Studies:
  • Explore the feasibility of new or upgraded products, technologies, processes, services, solutions and production facilities:
    • Power efficient FPGA technology and how IP-blocks could be integrated.
    • Firmware and software development environments.
    • High sampling speed high dynamic range and power efficient ADC and DAC technology.
    • Power efficient data transmission technology (within and between chip communication).
  • Develop strategies for ownership of supplier base including a silicon supply chain.
  • Develop strategies for development and ownership of a European foundry base aiming for advanced technology nodes for analog (RF) and digital circuits.
  • Develop strategy on how the military and civil community could interact to secure low-volume production.
• Design:
  • Design chip(s) and package for military RF CMOS components and modules for digital AESA Radars and wideband multifunctional RF systems from S to Ka Band.
  • Realisation and test of RF CMOS demonstrator for two applications: Digital AESA Radars and wideband multifunctional RF systems from S to Ka Band.

The proposals may also cover the realisation and test of RF-CMOS demonstrator for more than these two applications.

Functional requirements

The proposed products and technologies should meet the following functional requirements:

• Proposed relevant components and modules for the requirements for the supply chain.
• Defined advanced technology nodes needed for realisation of e.g. high-speed and high-performance data converters and FPGA.
• Components encapsulated in order to withstand military harsh environment.
• Applicability for several defence applications such as avionics, radar, electronic warfare, communications, data security, ammunition and missiles.
• Compliance with REACH and ROHS regulations.

The outcome should contribute to:

• reduce dependencies on non-European suppliers by boosting the EDTIB and promoting the development of a European solution;
• future establishment of a European RF-CMOS fine pitch supply chain for defence;
• secure the autonomy and non-dependent availability of critical analogue and digital functional building blocks in the next generations of digital wideband AESA RF systems;
• gained knowledge regarding design and manufacturing of RF-CMOS as required for defence applications;
• shared awareness on the need for RF-CMOS at European level as a basis for increased production volume for fine pitch chips in line with defence needs.